GlobeNewsWire
21 May 2026, 05:35 UTC · 15h ago
Source · https://www.globenewswire.com/news-release/2026/05/21/3299004/0/en/AMD-Announces-More-Than-10-Billion-in-Taiwan-Ecosystem-Investments-to-Accelerate-AI-Infrastructure.html
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AMD is investing more than $10 billion in the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for AI infrastructure. — A massive capital commitment of this scale signals aggressive growth and a direct challenge to competitors in the AI hardware market.
+0.80The AMD Helios rack-scale platform, featuring MI450X GPUs and 6th Gen EPYC CPUs, is targeted for deployment in the second half of 2026. — Provides a concrete timeline for next-generation product revenue and sets a benchmark for performance expectations.
+0.60AMD has partnered with major ODMs including Sanmina, Wiwynn, Wistron, and Inventec to move the Helios platform into high-volume manufacturing. — Validates the supply chain's ability to scale AMD's AI offerings, reducing execution risk for the product rollout.
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AMD is collaborating with packaging firms ASE, SPIL, PTI, and Unimicron to industrialize Elevated Fanout Bridge (EFB) and advanced substrate solutions. — Technological advancements in packaging are critical for maintaining a competitive edge in chip performance and cost-efficiency.
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Model heads
Announced a $10 billion investment to expand AI infrastructure and scale advanced packaging manufacturing.
Working closely with AMD on the mechanical architecture of the Helios program.
Working with AMD to industrialize Elevated Fanout Bridge technology for next-generation data centers.
Collaborating with AMD on panel-based EFB to improve scalability and cost efficiency for processors.
Acting as a leading ODM partner to scale AMD Helios from design to high-volume manufacturing.
Named as a leading ODM partner helping to build the high-performance AMD Helios-based systems.
Partnering with AMD to bring innovative packaging solutions to market for AI infrastructure.
Collaborating with AMD to deliver integrated, rack-scale AI infrastructure for hyperscalers.
Collaborating with AMD to deliver high-performance AI and data center systems.
[mutual] Sanmina is a leading ODM partner helping to build AMD Helios-based systems.
[mutual] Wiwynn collaborates with AMD on the Helios platform to deliver rack-scale AI infrastructure.
[mutual] Wistron is an ODM partner helping to build AMD Helios-based systems.
[mutual] Inventec collaborates with AMD on delivering high-performance AI and data center systems.
[mutual] ASE works with AMD to industrialize Elevated Fanout Bridge technology for advanced packaging.
[mutual] PTI collaborates with AMD on panel-based EFB for advanced packaging and processors.
