GlobeNewsWire
23 Jun 2026, 12:49 UTC · 3h ago
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GlobalFoundries' SLATE wafer-to-wafer bonding technology can reduce RF die size by up to 45%. — Significant reduction in die size directly lowers material costs and increases chip density, providing a strong competitive advantage in the high-volume mobile device market.
+0.60The 9SW SLATE technology is expected to ramp to volume production by the second half of 2027. — Provides a concrete timeline for revenue realization, though the distant date limits immediate short-term price movement.
+0.30The 9SW RF-SOI platform delivers a more than 20% enhancement in efficiency through lower on-resistance and off-capacitance. — Improved power efficiency is a key selling point for 5G and satellite hardware, enhancing the attractiveness of GF's foundry services.
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The company announced production readiness of SLATE technology and a strategic partnership with the U.S. Department of Energy.
The company's software is highlighted as an enabling tool for the adoption of GlobalFoundries' new SLATE technology.
Mentioned in the context of GlobalFoundries completing the acquisition of its ARC Processor IP Solutions.
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